Supply plasma etching.suzhou hua lin kena semiconductor equipment technology co., ltd. in Āgra

Product Description£ºModern VLSI processes avoid wet Etching, and use Plasma Etching instead. Plasma etchers can operate in several modes by adjusting the parameters of the Plasma. Ordinary Plasma Etching operates between 0.1 and 5 torr. (This unit of pressure, commonly used in vacuum engineering, equals approximately 133.3 pascals.) The Plasma produces energetic free radicals, neutrally charged, that react at the surface of the wafer. Since neutral particles attack the wafer from all angles, this process is isotropic.

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